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description the cxa1645p/m is an encoder ic that converts analog rgb signals to a composite video signal. this ic has various pulse generators necessary for encoding. composite video outputs and y/c outputs for the s terminal are obtained just by inputting composite sync, subcarrier and analog rgb signals. it is best suited to image processing of personal computers and video games. features single 5v power supply compatible with both ntsc and pal systems built-in 75 drivers (rgb output, composite video output, y output, c output) both sine wave and pulse can be input as a subcarrier. built-in band pass filter for the c signal and delay line for the y signal built-in r-y and b-y modulator circuits built-in pal alternate circuit burst flag generator circuit half h killer circuit applications image processing of video games and personal computers block diagram and pin configuration structure bipolar silicon monolithic ic absolute maximum ratings supply voltage v cc 14 v operating temperature topr ?0 to +75 ? storage temperature tstg ?5 to +150 ? allowable power p d cxa1645p 1250 mw dissipation cxa1645m 780 mw recommended operating condition supply voltage v cc 1, 2 5.0 0.25 v ?1 cxa1645p/m e93411a41-st rgb encoder sony reserves the right to change products and specifications without prior notice. this information does not convey any license by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustrating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. 24 pin dip (plastic) 24 pin sop (plastic) bpf phase shifter r-y modulator b-y modulator pulse gen video out 75 driver 75 driver regulator sync add clamp delay y/c mix matrix r-out g-out b-out clamp clamp clamp sin-pulse 2 3 4 5 1 8 9 6 7 11 12 10 15 16 17 13 14 18 19 20 21 22 23 24 syncin yclpc bfout npin scin bin gin rin gnd1 nc v cc 1 nc cout yout ytrap fo v cc 2 bout gout rout gnd2 v ref i ref cvout
?2 cxa1645p/m pin description * externally applied voltage 100 gnd1 v cc 1 i clp 180 100 2 3 4 pin no. symbol pin voltage 1 gnd1 0v * 2 3 4 rin gin bin 5 nc 6 scin 7 npin 1.7v 8 bfout h : 3.6v l : 3.2v black level when clamped 2.0v equivalent circuit description ground for all circuits other than rgb, composite video and y/c output circuits. the leads to gnd2 should be as short and wide as possible. subcarrier input. input 0.4 to 0.5vp-p sine wave or pulse. refer to notes on operation, nos. 3 and 5. pin for switching between ntsc and pal modes ntsc: v cc , pal: gnd bf pulse monitoring output. incapable of driving a 75 load. analog rgb signal inputs. input 100%, = 1vp-p (max.). to minimize clamp error, input at as low impedance as possible. i clp turns on only in the burst flag period. no connection 100 gnd1 v cc 1 2.5v 20k 20k 20p 129 6 gnd1 v cc 1 32k 68k 80k 3k 7 gnd1 v cc 1 25 129 8 25
?3 cxa1645p/m pin no. symbol pin voltage 9 yclpc 2.5v 10 sync in 12 v cc 1 5.0v * 13 i ref 2.0v 14 v ref 4.0v 2.2v equivalent circuit description pin to determine the y signal clamp time constant. connect to gnd via a 0.1f capacitor. power supply for all circuits other than rgb, composite video and y/c output circuits. refer to notes on operation. nos. 4 and 10. pin to determine the internal reference current. connect to gnd via a 47k resistor. internal reference voltage. connect a decoupling capacitor of approximately 10f. refer to notes on operation, nos. 4 and 7. composite sync signal input. input ttl- level voltages. l ( 0.8v): sync period h ( 3 2.0v) 1.6v gnd1 v cc 1 5 9 129 gnd1 v cc 1 2.2v 4k 40k 10 gnd1 v cc 1 50 129 13 gnd1 v cc 1 14
?4 cxa1645p/m pin no. symbol pin voltage 15 cout 2.2v 16 yout 17 ytrap black level 1.6v 18 fo 2.0v black level 1.3v equivalent circuit description chroma signal output. capable of driving a 75 load. refer to notes on operation, nos. 6 and 9. pin for reducing cross color caused by the subcarrier frequency component of the y signal. when the cvout pin is in use, connect a capacitor or a capacitor and an inductor in series between ytrap and gnd. decide capacitance and inductance, giving consideration to cross color and the required resolution. no influence on the yout pin. refer to notes on operation, no. 8. internal filter fo adjustment pin. connect to gnd via the following resistor according to the ntsc or pal mode. ntsc: 20k (1%) pal : 16k (1%) y signal output. capable of driving a 75 load. refer to notes on operation, nos. 6 and 9. 10k gnd2 v cc 2 15 20k 600 v cc 1 10k gnd2 v cc 2 20k 600 v cc 1 16 gnd1 v cc 1 1.5k 8.5k 0.5p 17 input resistance 1.5k w gnd1 v cc 1 129 50 18
?5 cxa1645p/m pin no. symbol pin voltage 19 v cc 2 5.0v * 20 cvout 21 22 23 bout gout rout black level 1.7v 24 gnd2 0v * black level 1.2v equivalent circuit description power supply for rgb, composite video and y/c output circuits. decouple this pin with a large capacitor of 10f or above as a high current flows. refer to notes on operation, nos. 4 and 10. analog rgb signal outputs. capable of driving a 75 load. refer to notes on operation, nos. 6 and 9. ground for rgb, composite video and y/c output circuits. the leads to gnd1 should be as short and wide as possible. composite video signal output. capable of driving a 75 load. refer to notes on operation, nos. 6 and 9. 10k gnd2 v cc 2 20k 600 v cc 1 20 gnd2 v cc 2 500 v cc 1 5.5k 200 gnd1 21 22 23
?6 cxa1645p/m electrical characteristics (ta = 25?, v cc = 5v, see the electrical characteristics measurement circuit.) item symbol s1 current consumption 1 current consumption 2 rgb output voltage (r, g, bout) i cc 1 i cc 2 s2 s3 s4 s5 rin gin bin scin npin sync in fo measu rement point 2v measurement conditions min. typ. max. unit sg4 5v sg5 20k i cc 1 i cc 2 no input signal, sg5: csync ttl level, sg4: sin wave 3.58mhz 0.5vp-p fig. 1 sg1 to sg3: dc direct coupling 2.5v dc , 1.0vp-p f = 200khz pin 9 = clamp voltage fig. 2 31 12 ma rgb output frequency characteristics v o (r) v o (g) v o (b) f c (r) f c (g) f c (b) sg1 sg2 sg3 sg1 sg2 sg3 2v 2v d f e d f e 0.64 0.71 0.78 vp-p ?.0 db sg1 to sg3: dc direct coupling 2.5v dc , 1.0vp-p f = 200khz/5mhz pin 9 = clamp voltage fig. 3 sg1 to sg3: 100% color bar input, 1.0vp-p (max.) sg5: csync ttl level fig. 4 (yout & cvout) output sync level r100%: y level g100%: y level b100%: y level white 100%: y level v o (ys1/2) v o (yr1/2) v o (yg1/2) v o (yb1/2) v o (yw1/2) output frequency characteristics f c (y1/2) sg1 to sg3 0v 5v sg5 20k sg1 to sg3 0v 5v 2v 20k b/c sg1 to sg3: dc direct coupling 2.5v dc , 1.0vp-p f = 200khz/5mhz pin 9 = clamp voltage fig. 3 0.26 0.17 0.35 0.065 0.6 0.29 0.21 0.42 0.08 0.71 0.33 0.26 0.49 0.095 0.82 vp-p v v v v ?.0 db * clamp voltage: voltage appearing at pin 9 when csync is input.
?7 cxa1645p/m sg1 to sg3: no signal, sg4: sin wave, 3.58mhz 0.5vp-p sg5: csync ttl level 3.58mhz component measured. fig. 6 sg1 to sg3: no signal, sg4: sin wave, 4.43mhz 0.5vp-p sg5: csync ttl level fig. 6 (cout & cvout) burst level r chroma ratio r phase g chroma ratio g phase b chroma ratio b phase burst width burst position carrier leak pal burst level ratio pal burst phase v o (bn1/2) r/bn1/2 q r1/2 g/bn1/2 q g1/2 b/bn1/2 q b1/2 t w (b) 1/2 t d (b) 1/2 v l1/2 k (bp1/2) q pal1/2 q pal1/2 sg1 to sg3 sg4 5v sg5 20k 0.2 sg1 to sg3 sg4 5v sg5 20k sg1 to sg3 sg4 gnd sg5 16k a/c sg1 to sg3: 100% color bar input, 1.0vp-p (max.) sg4: sin wave, 3.58mhz 0.5vp-p sg5: csync ttl level fig. 5 0.25 0.3 vp-p 2.84 3.16 3.48 94 104 114 deg 2.65 2.95 3.25 231 241 251 deg 2.01 2.24 2.47 337 347 357 deg 2.5 2.75 3.2 s 0.4 0.6 0.75 s 20 mvp-p 0.9 1.0 1.1 125 135 145 deg 215 225 235 * clamp voltage: voltage appearing at pin 9 when csync is input. item symbol s1 s2 s3 s4 s5 rin gin bin scin npin sync in fo measu rement point measurement conditions min. typ. max. unit
?8 cxa1645p/m electrical characteristics measurement circuit bpf phase shifter r-y modulator b-y modulator pulse gen video out 75 driver 75 driver regulator sync add clamp delay y/c mix matrix r-out g-out b-out clamp clamp clamp sin-pulse s1 s1 s1 0.1 sg1 0.1 sg2 0.1 sg3 2v sg1 to sg3 100% color bar (1vp-p max.) nc nc nc nc s2 s3 sg4 sin 0.5vp-p pal ntsc 5v s4 2v sg5 csync 0.1 5v 0.01 47 i cc 1 2 3 4 5 1 8 9 6 7 11 12 10 5v 47 220 a 75 75 a 220 75 75 b 220 75 75 c 220 75 75 d 220 75 75 e 220 75 75 f 0.01 a s5 ntsc pal 20k 16k 47k 0.1 10 15 16 17 13 14 18 19 20 21 22 23 24 i cc 2
?9 cxa1645p/m measuring signals and output waveforms sg4 scin sg5 sync in 64s 4.5s 2.0v 0.8v 0.5vp-p f = 3.58mhz fig. 1 fig. 2 sg1 to 3 rin gin bin def point rout gout bout v o 2.5v 1.0vp-p f = 200khz fig. 3 sg1 to 3 rin gin bin def bc point rout gout bout yout cvout v o 2.5v 1.0vp-p f = 200khz/5mhz fc = 20log vo (5mhz) vo (200khz) fig. 6 sg4 scin sg4 sync in c point cvout a point cout vo (bn) vo (bn) v l v l 4.5s 64s 0.5vp-p f = 3.58mhz/ 4.43mhz 2.0v 0.8v vo (bn) vo (bn) k (bp) = vo (bn) vo (bn) sg5 sync in sg1 rin sg2 gin sg3 bin bc point yout cvout 2.0v 0.8v 1.0vp-p 1.0vp-p 1.0vp-p vo (ys) vo (yb) vo (yr) vo (yg) vo (yw) fig. 4 64s 4.5s 10s fig. 5 sg4 scin sg5 sync in sg1 rin sg2 gin sg3 bin 0.5vp-p f = 3.58mhz 2.0v 0.8v 4.5s 64s 10s 1.0vp-p 1.0vp-p 1.0vp-p c point cvout t d (b) a point cout v o (bn) v o (cg) v o (cr) v o (cb) v o (cg) v o (cr) v o (cb) t w (b) v o (bn) t w (b) r/bn = v o (cr) v o (bn) g/bn = v o (cg) v o (bn) b/bn = v o (cb) v o (bn)
?10 cxa1645p/m application circuit (ntsc mode) application circuit (pal mode) bpf phase shifter r-y modulator b-y modulator pulse gen video out 75 driver 75 driver regulator sync add clamp delay y/c mix matrix r-out g-out b-out clamp clamp clamp sin-pulse 0.1 nc nc nc nc 0.1 0.01 47 +5v 47 220 75 220 75 220 75 220 75 220 75 220 75 r out 0.01 20k 47k 0.1 10 15 16 17 13 14 18 19 20 21 22 23 24 g out b out cv out c out y out b in 0.1 g in 0.1 r in scin sync in 2 3 4 5 1 8 9 6 7 11 12 10 v cc * 1% * metal film resistor 1% bpf phase shifter r-y modulator b-y modulator pulse gen video out 75 driver 75 driver regulator sync add clamp delay y/c mix matrix r-out g-out b-out clamp clamp clamp sin-pulse 0.1 nc nc nc nc 0.1 0.01 47 +5v 47 220 75 220 75 220 75 220 75 220 75 220 75 r out 0.01 16k 47k 0.1 10 15 16 17 13 14 18 19 20 21 22 23 24 g out b out cv out c out y out b in 0.1 g in 0.1 r in scin sync in 2 3 4 5 1 8 9 6 7 11 12 10 v cc * 1% * metal film resistor 1% application circuits shown are typical examples illustrating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
?11 cxa1645p/m description of operation analog rgb signals input from pins 2, 3 and 4 are clamped in the clamping circuit and output from pins 23, 22 and 21, respectively. the matrix circuit performs operations on each input signal, generating luminance signal y and color difference signals r-y and b-y. the y signal enters the delay line to adjust delay time with the color signal c. then, after addition of the csync signal input from pin 10, the y signal is output from pin 16. a subcarrier input from pin 6 is input to the phase shifter, where its phase is sfited 90? then, the subcarrier is input to the modulators and modulated by the r-y signal and the b-y signal. modulated subcarriers are mixed, sent to the band pass filter to eliminate higher harmonic components and finally output from pin 15 as the c signal. at the same time, y and c signals are mixed and output from pin 20 as the composite video signal. burst signal the cxa1645p/m generates burst signals at the timing shown below according to the composite sync signal input. h synchronization v synchronization burst signal t d (b) t w (b) t d (b) t w (b) sync in (ttl level) c video out cout burst signal synchronizing signal sync in c video out odd even odd even
?12 cxa1645p/m notes on operation be careful of the following when using the cxa1645p/m. 1. this ic is designed for image processing of personal computers and video games. when using the ic in other video devices, make thorough investigations on image quality. 2. be sure that analog rgb signals are input at 1.0vp-p maximum and have low enough impedance. high impedance may affect color saturation, hue, etc. inputting rgb signals in excess of 1.3vp-p may disable the clamp operation. 3. the sc input (pin 6) can be either a sine wave or a pulse in the range from 0.4 to 5.0vp-p. however, when a pulse is input, its phase may be shifted several degrees from that of the sine wave input. in the ic, the sc input is biased to 1/2 v cc . accordingly, when a 5.0vp-p pulse is input and the duty factor deviates from 50%, high- and low-level pulse voltages may exceed v cc and gnd in the ic, which causes subcarrier distortion. in such a case, be very careful that the duty factor keeps to 50%. 4. when designing a printed circuit board pattern, pay careful attention to the routing of the v cc and gnd leads. to decouple the v cc and v ref pins, use tantalum, ceramic or other capacitors with good frequency characteristics. ground the capacitors by connections shown below as closely to each ic pin as possible. try to design the leads as short and wide as possible. v cc 1, v ref ... gnd1 v cc 2 ... gnd2 design the pattern so that v cc (or v ref ) is connected to gnd via a capacitor at the shortest distance. 5. sc and sync input pulses attach a resistor and a capacitor to eliminate high-frequency components of sc (figure a) and sync (figure b) before input. be careful not to input pulses containing high-frequency components. otherwise, high-frequency components may flow into v cc , gnd and peripheral parts, resulting in malfunctions. 6. connecting an external resistor to the 75 driver output pin a capacitance of several dozen picofarads at each pin may start oscillation. to prevent oscillation, design the pattern so that a 75 resistor is mounted near the pin (see figure c). when any of the 75 driver output pins is not in use, leave it unconnected and design the pattern so that no parasitic capacitance is generated on the printed circuit board. fig. a 2.2k 5p fig. b 2.2k 47p fig. c 75 ** * make these leads short.
?13 cxa1645p/m 7. v ref pin (pin 14) do not connect this pin to an external load that might cause ac signals to flow, which will cause ic malfunctions. when connecting a dc load, make sure that the current flowing from this pin is kept below 2ma. 8. ytrap pin (pin 17) there are the following two means of reducing cross color generated by subcarrier frequency components contained in the y signal. (1) install a capacitor of 30 to 68pf between ytrap and gnd. decide the capacitance by conducting image evaluation, etc., giving consideration to both cross color and resolution. relations between capacitance and image quality are as follows: (2) connect a capacitor c and an inductor l in series between ytrap and gnd. when the subcarrier frequency is fo, the values c and l are determined by the equation fo = . decide the values in image evaluation, etc., giving consideration to both cross color and resolution. relations between inductor values and image quality are as follows: for instance, l = 68h and c = 28pf are recommended for ntsc. it is necessary to select an inductor l with a sufficiently small dc resistance. method (2) is more useful for achieving a higher resoluation than method (1). when an even higher resolution is necessary, use of the s terminal (yout and cout) is recommended. 9. driving cout (pin 15), yout (pin 16), cvout (pin 20), and b.g.r out (pins 21, 22 and 23) outputs in pin description, "capable of driving a 75 load" means that the pin can drive a capacitor +75 +75 load shown in the figure below. in other words, the pin is capable of driving a 150 load in ac. keep in mind that the pin is incapable of driving a 150 load in dc load in dc direct coupling. 10. this ic employs a number of 75 driver pins, so oscillation is likely to occur when measures described in nos. 4 and 6 are not taken thoroughly. be very careful of oscillation in printed circuit board design and carry out thorough investigations in the actual driving condition. capacitance 30pf ?? 68pf cross color resolution large ?? small high ?? low 17 c inductor value small ?? large cross color resolution large ?? small high ?? low 17 c l 1 2 p? lc 75 w 220f 75 w pin
?14 cxa1645p/m package outline unit: mm cxa1645p cxa1645m 24pin dip (plastic) 400mil 30.2 ?0.1 + 0.4 8.5 ?0.1 + 0.3 0.25 ?0.05 + 0.1 24 13 112 2.54 10.16 0?to 15 3.7 ?0.1 + 0.4 0.5 0.1 1.2 0.15 3.0 min 0.5 min sony code eiaj code jedec code package structure package material lead treatment lead material package weight epoxy resin solder plating copper / 42 alloy dip-24p-01 * dip024-p-0400-a 2.0g sony code eiaj code jedec code m package structure molding compound lead treatment lead material package weight epoxy/phenol resin solder plating copper alloy / 42alloy 24pin sop (plastic) 15.0 ?0.1 + 0.4 112 13 24 1.27 0.45 0.1 5.3 ?0.1 + 0.3 7.9 0.4 0.2 ?0.05 + 0.1 0.5 0.2 0.1 ?0.05 + 0.2 0.15 1.85 ?0.15 + 0.4 6.9 0.12 sop-24p-l01 * sop024-p-0300-a 0.3g

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